Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components

ABSTRACT

A field-replaceable active pumped liquid heat sink module includes a front portion and a back portion, each including a liquid pump, a radiator, an optional receiver, and a cold plate heat exchanger, all of which are connected together in a liquid pump loop through which a coolant such as water is circulated. The liquid pump, radiator, optional receiver and cold plate heat exchanger are in a liquid pump loop and are self-contained in a field-replaceable active pumped liquid heat sink module.

FIELD OF THE INVENTION

The present invention is related to heat sinks for removing heat fromelectronic components such as integrated circuit processors.

BACKGROUND OF THE INVENTION

Removal of heat has become one of the most important challenging issuesfacing computer system designers today. As the rate of power dissipationfrom electronics components such as high performance server processorscontinues to increase, standard conduction and forced-air convection fanair cooling techniques no longer provide adequate cooling for suchsophisticated electronic components. The reliability of the electronicsystem suffers if high temperatures at hot spot locations are permittedto persist. Conventional thermal control schemes such as air coolingwith fans, thermoelectric cooling, heat pipes, and passive vaporchambers have either reached their practical application limit or aresoon to become impractical for high power electronic components such ascomputer server processors. When standard cooling methods are no longeradequate, computer manufacturers have to reduce the frequency of theirprocessors to match the capacity of existing cooling apparatus.Furthermore, reliability can be compromised due to inadequate coolingusing an existing cooling apparatus, or product release delayed until areliable cooling apparatus for removal of heat from high heatdissipating processors can be made available.

The computer industry is seriously considering utilizing active liquidcooling as an alternative to conventional passive air cooling for highperformance and high power processors. A number of attempts toincorporate liquid for cooling of high powered processors in the form ofsubmerged liquid, liquid spray cooling, refrigeration cooling, and thelike have been attempted in the past, but none of the existing activeliquid cooling solutions has been utilized outside of specific designconditions. Additionally, these cooling solutions, while effective, caninclude a relatively high number of moving parts that can lead toincreased product and maintenance costs.

What is desired, therefore, is a field-replaceable heat sink module thatemploys active liquid cooling, but has the same appearance as atraditional air-cooling heat sink, is sturdy, reliable, compact, simpleto use, relatively inexpensive, and can be effectively employed in awide range of applications.

SUMMARY OF THE INVENTION

According to an embodiment of the present invention, a field and/orcustomer replaceable integrated active pumped liquid heat sink module issuitable for thermal management of high heat dissipation in electroniccomponents such as server processors. The field-replaceable integratedactive pumped liquid heat sink module is self-contained and isspecifically designed to have physical dimensions similar to those of astandard air-based cooling system, such as a finned heat sink or a heatpipe. As a result, the field replaceable integrated active liquid-pumpedheat sink module can be utilized in existing electronic systems withoutthe need for board or cabinet/rack modification or the “plumbing”associated with prior art liquid-based cooling systems.

According to an embodiment of the present invention, a field-replaceableactive pumped liquid heat sink module includes a “front” and a “back”portion, each including a liquid pump, a radiator, an optional receiver,and a cold plate heat exchanger, all of which are connected together ina liquid pump loop through which a coolant such as water is circulated.The liquid pump, radiator, optional receiver and cold plate heatexchanger are in a liquid pump loop and are self-contained in afield-replaceable active pumped liquid heat sink module.

From the view point of the end user, the entire liquid pump apparatus ishermetically-sealed and contained in the heat sink module and besidesthe electric wires needed to power up the liquid pump, there is nodifference in external appearance of a conventional heat sink and theheat sink module of the current invention. The cold plate heat exchangercan be positioned in thermal contact with a heat source (such as the lidof a processor) of an electronic component, that is to be cooled.

As is understood by those of ordinary skill in the art, a liquid pumppumps the coolant out of a radiator. The heat of the high temperaturecoolant is removed in the radiator by the air blown by a system fan. Inthe radiator, the coolant is allowed to cool before being conveyed to areceiver. From the optional receiver, the coolant liquid is drawn backinto the pump, out of which the liquid coolant passes into a cold plateheat exchanger. The liquid coolant is heated up in the cold plate heatexchanger and in the process absorbs heat from heat source (such as aserver processor) to produce the desired cooling effect. From theradiator heat exchanger the coolant liquid is drawn back into pump tobegin another cycle through pumped liquid cycle.

The field-replaceable integrated active-pumped liquid heat sink moduleof the present invention is a modified liquid-based cooling system andtherefore provides the cooling capacity of prior art liquid-basedcooling systems. However, unlike prior art liquid-based cooling systems,the field replaceable integrated active liquid pumped heat sink moduleof the present invention is modular and self-contained and is thereforefield and/or customer replaceable with minimal effort using standardtools. In addition, unlike prior art liquid-based cooling systems, thefield replaceable integrated active liquid-pumped heat sink module ofthe present invention is capable of being attached directly to thecomponents (such as processors) that need cooling. In addition the fieldreplaceable integrated active liquid-pumped heat sink module of thepresent invention is compact and simple in both operation andinstallation, with minimal parts to fail or break and minimal addedcomplexity. Therefore the field replaceable integrated active liquidpumped heat sink module of the invention is sturdy and reliable.

The foregoing and other features, utilities and advantages of theinvention will be apparent from the following more particulardescription of an embodiment of the invention as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows two cross-sectional views and a bottom view of a unitaryfield-replaceable active integrated liquid pump heat sink moduleaccording to an embodiment of the present invention;

FIG. 2 shows two cross-sectional views and a bottom view of a “front”portion of a multi-component field-replaceable active integrated liquidpump heat sink module according to an embodiment of the presentinvention; and

FIG. 3 shows two cross-sectional views and a bottom view of a “back”portion of a multi-component field-replaceable active integrated liquidpump heat sink module according to an embodiment of the presentinvention.

DETAILED DESCRIPTION

Referring now to FIG. 1, a first cross-sectional view 100 of a unitaryfield-replaceable active integrated liquid pump heat sink moduleaccording to an embodiment of the present invention includes a heat sinkcasing 114, which is typically fabricated out of aluminum, copper, oralloys thereof, or other similar metals or alloys, and is about 0.25inches thick. The overall dimensions of the heat sink casing aretypically about 5.0 inches by 3.0 inches by 1.75 inches in a unitaryembodiment, and about 7.0 inches by 5.0 by 1.75 inches in amulti-component embodiment, but can of course be changed as desired fora particular application. A cold plate heat exchanger 106 is embeddedinto the heat sink casing 114, such that only a small thickness ofmaterial separates the cold plate heat exchanger 106 from the topsurface of an integrated circuit processor (not shown in FIG. 1) orother integrated circuit so that the maximum amount of heat can beremoved. The remaining thickness at the bottom of the heat sink casing114 shown in FIG. 1 is between about 2.0 and 5.0 mm, but this range canalso be changed as desired for a particular application. Cold plate heatexchangers are known in the art. A suitable cold plate heat exchangerwould be a micro-channel heat exchanger, but other such cold plate heatexchangers could also be used. A hot liquid output line 118 is coupledto a radiator heat exchanger 120. The hot liquid output line 118 isfabricated out of copper or aluminum. The dimensions of the hot liquidoutput line 118 are about 1.5 inches long by about 0.125 inches, outsidediameter, but these dimensions are tailored to the form factor of theoverall heat sink casing. The wall thickness of the hot liquid outputline 118 is between 1.0 and 2.0 mm. The dimensions of the hot liquidoutput line 118 are maintained for the other liquid lines throughout theradiator heat exchanger 120. The fluid lines in the radiator heatexchanger 120 are separated by a number of radiator fins 122, which arefabricated out of aluminum or copper. The radiator fins 122 can be anydimensions required for a required form factor, but are typically about4.0 inches long and about 0.125 inches thick. A fluid such as water or amixture of water and glycol or other such media flows through the linesin the radiator heat exchanger 120, and is gradually cooled without anyphase change. The fluid is fully cooled at the uppermost line in theradiator heat exchanger 120 and emerges as the cold liquid return line124 once fully cooled. In a typical application, the temperature of thefluid in the hot liquid output line 118 could be as high as 110° C.,and, with proper air flow from an accompanying fan (not shown in FIG. 1)the temperature of the fluid in the cold liquid return line 124 can beas low as 25° C. The cold liquid return line 124 is coupled to the inputport of a liquid pump 126. In accordance with an embodiment of thepresent invention, the liquid pump 126 is one of several new generationpumps that are relatively small, on the order of 1.5 inches in diameterand 3.0 to 4.0 inches long, although other dimension pumps can of coursebe used to fit a particular form factor. A suitable pump 126 for theunitary heat sink embodiment shown in FIG. 1 is a brushless miniaturespherical pump. A miniature diaphragm pump or a positive displacementpump could also be used. The output port of liquid pump 126 is coupledto the cold liquid input line 116, which in turn is coupled to the inputport of the cold plate heat exchanger 106 to complete the closed liquidflow path. Electrical connections 132 are provided to activate theliquid pump 126, which are the only outside connections required by theunitary heat sink module according to the present invention. The liquidpump 126 typically consumes about 10.0 watts of power, and is energizedby a 12.0 volt connection and a ground connection. In themulti-component embodiment, each liquid pump consumes about 10.0 wattsof power.

A second cross-sectional view 102 of a unitary field-replaceable activeintegrated liquid pump heat sink module according to an embodiment ofthe present invention is also shown in FIG. 1, which is orthogonal tocross-sectional view 100. Cross-sectional view 102 allows further detailof the heat sink module to be shown. The cross-sectional view of theheat sink casing 114 shows embedded cold plate heat exchanger 106. Thecross-sectional view of the cold plate heat exchanger allows a view ofthe cold plate heat exchanger liquid channel 106. The liquid channel 106is only a representative view of a slice through cold plate heatexchanger 106 at a particular plane therethrough, and thus the actualports engaging the hot liquid output line 118 and cold liquid input line116 are not shown. In cross-sectional view 102, the individual radiatorheat exchanger liquid flow channels 128 are visible, as well as a sideview of one course of the radiator heat exchanger fin plates 130.

A second bottom view 104 of a unitary field-replaceable activeintegrated liquid pump heat sink module according to an embodiment ofthe present invention is also shown in FIG. 1. The bottom view 104 showsthe “footprint” of the heat sink base plate 110, as well as thefootprint of the cold plate heat exchanger base plate 112, that willreside on top of the lid of the integrated circuit processor or othercircuit. Note that in bottom view 104, the actual cold plate heatexchanger base plate 112 is covered by a thin layer of heat sink casingmaterial. Two cross-sectional lines 100 and 102 are shown in the bottomview 104, representing the relative cross-sectional cuts for first andsecond cross-sectional views 100 and 102.

Referring now generally to FIG. 2, a first portion of a multi-componentfield-replaceable active integrated liquid pump heat sink module isshown according to an embodiment of the present invention. It isimportant to note in FIG. 2, that the “100” series of identificationnumerals referred to in FIG. 1 generally correspond to the “200” seriesshown in FIG. 2. In addition, the dimensions and selection of thecomponents are generally the same, except as noted below.

Cross-sectional view 200 only depicts the components in the “front”portion of the heat sink module. The components in the “back” portion ofthe same heat sink module are described below with respect to FIG. 3.Thus, shown in FIG. 2 are the heat sink casing 214, a first cold plateheat exchanger 206 embedded into the heat sink casing 214, such thatonly a small thickness of material separates the cold plate heatexchanger 206 from the top surface of a first integrated circuitprocessor (not shown in FIG. 2) or other integrated circuit. A first hotliquid output line 218 is coupled to a first radiator heat exchanger220. The dimensions of the hot liquid output line 118 are about 1.5inches long by 0.125 inches, outside diameter, but these dimensions aretailored to the form factor of the overall heat sink casing. Mostpertinently, the dimensions are adjusted to make sure that the firstradiator heat exchanger 220 and the second radiator heat exchanger 320(described below) both fit into the same heat sink module. Thedimensions of the hot liquid output line 218 are maintained for theremaining fluid lines throughout the radiator heat exchanger 220. Thefluid lines in the radiator heat exchanger 220 are separated by a numberof radiator fins 222. The cold liquid return line 224 is coupled to theinput port of a first liquid pump 226. The output port of the firstliquid pump 226 is coupled to the cold liquid input line 216, which inturn is coupled to the input port of the first cold plate heat exchanger206 to complete the closed liquid flow path. Electrical connections 232are provided to activate the first liquid pump 226.

A second cross-sectional view 202 of a multi-component field-replaceableactive integrated liquid pump heat sink module according to anembodiment of the present invention is also shown in FIG. 2, which isorthogonal to cross-sectional view 200. Cross-sectional view 202 allowsfurther detail of the heat sink module to be shown. The cross-sectionalview of the heat sink casing 214 shows embedded cold plate heatexchanger 206. The cross-sectional view of the cold plate heat exchangerallows a view of the cold plate heat exchanger liquid channel 206. Incross-sectional view 202, the individual radiator heat exchanger liquidflow channels 228 are visible, as well as a side view of one course ofthe radiator heat exchanger fin plates 230. There are two sets of liquidflow channels and fin plates visible in cross-sectional view 202corresponding to the components in the front and back portionsmulti-component heat sink module.

A second bottom view 204 of the multi-component field-replaceable activeintegrated liquid pump heat sink module according to an embodiment ofthe present invention is also shown in FIG. 2. The bottom view 204 showsthe footprint of the heat sink base plate 210, as well as the footprintof the first and second cold plate heat exchanger base plates 212 and312, that will reside on top of the lids of two integrated circuitprocessors or other circuits. Two cross-sectional lines 200 and 202 areshown in the bottom view 204, representing the relative cross-sectionalcuts for first and second cross-sectional views 200 and 202. It isimportant to note that cross-sectional line 200 may have to be adjustedup or down in bottom view 204 to provide the cross-sectional viewsactually shown in FIGS. 2 and 3. This adjustment may be necessary due tothe exact physical placement of liquid pumps 226 and 326 within the heatsink module.

Referring now generally to FIG. 3, a second portion of a multi-componentfield-replaceable active integrated liquid pump heat sink module isshown according to an embodiment of the present invention. It isimportant to note in FIG. 3, that the “100” series of identificationnumerals referred to in FIG. 1 generally correspond to the “300” seriesshown in FIG. 3. In addition, the dimensions and selection of thecomponents are generally the same, except for the same shared heat sinkcasing 214 and the same shared heat sink base plate 210, and as notedbelow.

Cross-sectional view 300 only depicts the components in the “back”portion of the heat sink module. Thus, shown in FIG. 3 are the heat sinkcasing 314, a second cold plate heat exchanger 306 embedded into theheat sink casing 314, such that only a small thickness of materialseparates the cold plate heat exchanger 206 from the top surface of asecond integrated circuit processor (not shown in FIG. 3) or otherintegrated circuit. A second hot liquid output line 318 is coupled to asecond radiator heat exchanger 320. The fluid lines in the radiator heatexchanger 320 are separated by a number of radiator fins 322. The coldliquid return line 324 is coupled to the input port of a second liquidpump 326. The output port of the second liquid pump 326 is coupled tothe cold liquid input line 316, which in turn is coupled to the inputport of the second cold plate heat exchanger 306 to complete the closedliquid flow path. Electrical connections 332 are provided to activatethe first liquid pump 326.

A second cross-sectional view 302 of a multi-component field-replaceableactive integrated liquid pump heat sink module according to anembodiment of the present invention is also shown in FIG. 3, which isorthogonal to cross-sectional view 300. The cross-sectional view of theheat sink casing 214 shows a second embedded cold plate heat exchanger306. The cross-sectional view of the cold plate heat exchanger allows aview of the cold plate heat exchanger liquid channel 306. Incross-sectional view 302, the individual radiator heat exchanger liquidflow channels 328 are visible, as well as a side view of one course ofthe radiator heat exchanger fin plates 330. There are two sets of liquidflow channels and fin plates visible in cross-sectional view 302corresponding to the components in the front and back portionsmulti-component heat sink module.

A second bottom view 304 of the multi-component field-replaceable activeintegrated liquid pump heat sink module according to an embodiment ofthe present invention is also shown in FIG. 3. The bottom view 204 showsthe footprint of the heat sink base plate 210, as well as the footprintof the first and second cold plate heat exchanger base plates 212 and312, that will reside on top of the lids of two integrated circuitprocessors or other circuits. Two cross-sectional lines 300 and 302 areshown in the bottom view 304, representing the relative cross-sectionalcuts for first and second cross-sectional views 200 and 302. It isimportant to note that cross-sectional line 300 may have to be adjustedup or down in bottom view 304 to provide the cross-sectional viewsactually shown in FIGS. 2 and 3. This adjustment may be necessary due tothe exact physical placement of liquid pumps 226 and 326 within the heatsink module. While the invention has been particularly shown anddescribed with reference to embodiments thereof, it will be understoodby those skilled in the art that various other changes in the form anddetails may be made without departing from the spirit and scope of theinvention. It should be understood that this description has been madeby way of example, and that the invention is defined by the scope of thefollowing claims.

1. A field-replaceable, self-contained heat sink module employing activeliquid cooling of a plurality of electronic components comprising: acommon heat sink casing; a front portion and a back portion forming, incombination with the common heat sink casing, the modular self-containedheat sink module, each portion including: a radiator heat exchangerincluding a hot liquid output line and a cold liquid return line; a coldplate heat exchanger embedded in the heat sink casing, wherein the heatsink casing is in direct contact with the plurality of electroniccomponents, the cold plate heat exchanger having an input coupled to acold liquid input line, and an output coupled to the hot liquid outputline; a liquid pump having an input port coupled to the cold liquidreturn line and an output port coupled to the cold liquid input line,wherein the entire liquid pump apparatus including the radiator heatexchanger, cold plate heat exchanger, and liquid pump is hermeticallysealed and contained within the heat sink module; and an electricalconnection for receiving electrical pump power.
 2. The multi-componentheat sink module of claim 1 wherein the overall dimensions of the heatsink casing are about 7.0 inches by 5.0 inches by 1.75 inches.
 3. Themulti-component heat sink module of claim 1 wherein a remainingthickness at the bottom of the heat sink casing is between about 2.0 and5.0 mm.
 4. The multi-component heat sink module of claim 1 wherein thecold plate heat exchanger comprises a micro-channel heat exchanger. 5.The multi-component heat sink module of claim 1 wherein a cooling fluidused in the radiator heat exchanger, cold plate heat exchanger, and pumpcomprises water.
 6. The multi-component heat sink module of claim 1wherein a cooling fluid used in the radiator heat exchanger, cold plateheat exchanger, and pump comprises a mixture of water and glycol.
 7. Themulti-component heat sink module of claim 1 wherein a cooling fluidflows through the radiator heat exchanger, cold plate heat exchanger,and pump in a closed system without any phase change.
 8. Themulti-component heat sink module of claim 1 wherein the overalldimensions of the liquid pump are about 1.5 inches in diameter andbetween 3.0 to 4.0 inches long.
 9. The multi-component heat sink moduleof claim 1 wherein the liquid pump comprises a brushless miniaturespherical pump, a miniature diaphragm pump or a positive displacementpump.
 10. A field-replaceable, self-contained heat sink module employingactive liquid cooling of a plurality of electronic componentscomprising: a common heat sink casing; a front portion and a backportion forming, in combination with the common heat sink casing, themodular self-contained heat sink module each portion including: aradiator heat exchanger; a cold plate heat exchanger embedded in theheat sink casing, wherein the heat sink casing is in direct contact withthe plurality of electronic components; and a liquid pump havingelectrical connections for receiving electrical pump power, wherein theradiator heat exchanger, cold plate heat exchanger, and liquid pump arephysically coupled together to form a closed active liquid coolingsystem that is hermetically sealed and self-contained within the heatsink module.
 11. The multi-component heat sink module of claim 10wherein the overall dimensions of the heat sink casing are about 7.0inches by 5.0 inches by 1.75 inches.
 12. The multi-component heat sinkmodule of claim 10 wherein a remaining thickness at the bottom of theheat sink casing is between about 2.0 and 5.0 mm.
 13. Themulti-component heat sink module of claim 10 wherein the cold plate heatexchanger comprises a micro-channel heat exchanger.
 14. Themulti-component heat sink module of claim 10 wherein a cooling fluidused in the radiator heat exchanger, cold plate heat exchanger, and pumpcomprises water.
 15. The multi-component heat sink module of claim 10wherein a cooling fluid used in the radiator heat exchanger, cold plateheat exchanger, and pump comprises a mixture of water and glycol. 16.The multi-component heat sink module of claim 10 wherein a cooling fluidflows through the radiator heat exchanger, cold plate heat exchanger,and pump in a closed system without any phase change.
 17. Themulti-component heat sink module of claim 10 wherein the overalldimensions of the liquid pump are about 1.5 inches in diameter andbetween 3.0 to 4.0 inches long.
 18. The multi-component heat sink moduleof claim 10 wherein the liquid pump comprises a brushless miniaturespherical pump, a miniature diaphragm pump or a positive displacementpump.